Semiconductor, Thin Film, and Ceramics Expert

Technical Consultant #1954

Semiconductor Processing: Ion implantation, epitaxy, plasma and wet etch, thin film deposition, and cleaning.
CMOS (Complementary Metal-Oxide-Semiconductor) process flow and process integration.
Micro-electro-mechanical systems - MEMS
Radiation hardening for integrated circuits.
Ionizing radiation processing for semiconductors, glass, and polymers.
Antireflective glass - moth eye surface.
Glass and ceramics: Making glass and ceramics, non-glare, non-reflective, fingerprint repelling, antimicrobial, scratch resistant and self-cleaning.
Surface modification, surface smoothing, and surface damage removal.
Thin films: Transfer silicon film during the ion implantation thin film transfer process.
Compound semiconductors - gallium nitride GaN, silicon carbide SiC substrates for light emitting diodes. Other areas include:
Crystal growth
Nanotechnology
Silicon-on-Insulator - SOI
Layer transfer (Smart-cut) process.
Wafer bonding.
Solar cells (silicon based).

Expert Witness Experience

Independent Consultant, 2012 - Present

Corning, Inc. , Corning, NY, Research Associate, 2008 - 2012

Invented glass surface modification making moth eye like surface topology.
Resulting glass has lower reflectivity than any other glass.
Enormous application potential for TV, computer, handheld screens and solar cell cover glass.
Conceptualized process for chemical glass machining, similar to fotoform process, but no high temperature anneal needed.
Next generation substrates for printed circuit boards thus enabled.
Solved problems of single crystal silicon layer transfer onto glass by modifying smart-cut process.
Silicon-on-glass substrate for potential use; computer integrated with display on a single sheet.
Critically contributed to process of making solar silicon wafers directly from molten silicon (kerf-free) - cost of silicon substrates for solar cells can be significantly reduced.
Provided a way to add self-cleaning, fingerprint-repelling, and self-disinfecting property to face surfaces of handheld devices - potentially can be used in all next generations handheld devices.

MEC Tech, Toms River, NJ, Chief Scientist, 2005 - 2008

Developed process for making single crystalline silicon focus rings for plasma etching equipment - significantly lowered the cost.
Implemented chemical polishing of crystalline silicon thus enabling complicated shapes to be polished: Quality of showerheads and focus rings for plasma equipment significantly improved.

Silicon Wafer Technologies, Newark, NJ, Chief Technology Officer, 2000 - 2005

CTO and Co-Founder

Identified sources, prepared proposals, and obtained over $2 million funding to develop company product - silicon-on-insulator (SOI) wafer.
Covered SOI process with numerical patents, thus established company' competitive edge in intellectual property.
Fabricated prototypes of ultrathin SOI wafers useful for manufacturing of next generation chips.
publicized company with presentations at many international conferences, and venture capital companies.

Credentials

Post Doctorate: MEMS (Microelectromechanical Systems), New Jersey Institute of Technology, Newark, NJ.

Languages

Academic and Professional Affiliations

Awards

Awarded; O-1 (extraordinary abilities) visa by Immigration Office to enter U.S. - Currently a U.S. Citizen.
Research grants from Soros, North Atlantic Treaty Organization, and Fulbright foundations.
Small Business Innovation Research - SBIR Phase I, Phase II from US Ballistic Missiles, U.S. Army, U.S. Navy, National Science Foundation, New Jersey Springboard fund.

Publications and Patents

Over 100 publications including in top referred journals - Japanese Journal of Applied Physics, Journal of Material Science, Semiconductor Science and Technology, IEEE Transactions on Nanotechnology and many others.
Over 20 Patents, many patents pending.

Ph.D. Physics, Material Science, Moscow Technological University Moscow, Russia
M.S.E.E. Semiconductors, Moscow Institute of Electronics Technology, Moscow, Russia